Solder Paste Details

Premier industries high quality solder paste are uniquely formulated for superior performance to satisfy variety of assembly requirement, exact requirement of SMT component assembly, hybrid and chip bumping application, Premier Industries has developed solder paste for Indian electronic industries. Solder Paste is a homogenous mixture of finely graded oxide free pre-alloyed solder powder suspended on a thixotropic flux. Extremely rapid flow and increased wetting are obtained on bond solder paste.. Flux residue after soldering becomes highly reliable coating with excellent insulation resistance

NO CLEAN TYPE SOLDER PASTE

No-clean solder paste is by far the most prevalent solder paste in modern electronic manufacturing, but there is still a purpose and a fit for water-soluble and RMA solder paste as well Designed for fine pitch application and ensures continual printing. It is highly reliable and requires no cleaning: Exhibits excellent wettability. Ensures minimal slumping and prevents solder balling and bridging. Low colour flux residue offers superior cosmetic appearance.

Specification

• 1. Metal : Tin & lead
• 2. Alloy : Sn63Pb37 , Sn60Pb40, Sn55Pb45
• 3. Brand :

Details & features

• 1. Different jar size : 500g
• 2. Excellent Quality
  • ~ Good Viscosity
  • ~ Good fluidity
  • ~ 6 months shelf life when refrigerated
• 3. 3. Good printing effect
  • ~ Easy to printing
  • ~ Good wetting property
  • ~ Good slump resistance after printing
• 3. 4. Good solder ability
  • ~ Round & nice solder bead
  • ~ Bright solder joints
  • ~ No clean flux

APPLICATIONS

• 1. 1. Hot air gun manual soldering
• 2. 2. Reflow oven soldering