COMPOSITION | MELTING POINT °C | TENSILE STRENGTH Mpa/min | RECOMMENDED APPLICATION |
Sn95.5/Ag4.0/Cu0.5 | 217-218 | 37 | Used in electronic , electrical and components |
Sn96.5/Ag3.0/Cu0.5 | 217-219 | 37 | Eutectic alloy . Suitable forall types of pcbs .Excelellent soldering results in wave soldering and good SMTprocess |
Sn99/Ag0.3/Cu0.7 | 225-227 | 25 | Most common solder alloy suitable for soldering of multilayer , PTH and single sided pcbs. Used in wave, dip and HAL soldering applications |
Sn99.2/Cu0.6/Ag0.1 | 217-228 | 32 | Low silver contents |
Sn99/Cu0.6/Bi0.4 | 219-225 | 32 | Low cost proprietary lead free alloy |
Sn99.3/Cu0.7 | 227 | 28 | General purpose lead free alloy for soldering of electrical / electronics components and pcbs |
Sn99.0/Cu1.0 | 227 | 32 | Best suitable for electricals and metal components |
Sn95/Sb5 | 236-243 | 35.2 | Special alloy for automobile industry |
Sn80/Zn20 | 200 | 44 | For aluminium soldering applications . |
Sn/Zn/bi 4.0 | 190-197 | Low melting alloy for aluminium soldering | |
Sn 99.9 / Ag 0.1 | 227 | Replenishment SnSn99.2/Cu0.6/Ag0.1 to stabilize copper in solder bath |
Lead Free Solder Wire- Sn99.3Cu0.7
Brand | Ansol |
Composition | Sn99.3Cu0.7 |
Type of flux | RMA |
Melting Point | 227-260℃ |
Application | Used in electronic and electrical components |